PD-C AMAOE With Magnetic Base Universal Reballing Set

Features: Stencil magnetic suction leveling, free hands; scraping tin does not move, more uniform, with the magnet base to use, planting tin is more simple and convenient, not easy drums Innovative slope design, so that the chip is more closely, compatible with thinner chip C, pads do not overhang more evenly Good compatibility, suitable for 0.9mm thickness chip, most of the current mobile phone chip auxiliary tin planting Strong expandability, applicable to more than 50mm size stencil, supports Amaoe single CPU mesh, integrated mesh, CPU integrated mesh, and so on. High-temperature resistance, good heat insulation effect, heat insulation pad with adhesion characteristics, non-slip and non-displacement Soft and not easy to deform, good elasticity, can be curled at will, not attenuated deformation for a long time Show More Show Less